The Chinese phone maker Oppo’s sub brand Realme is set to launch another handset in China very soon. The upcoming phone is called Realme X9 Pro. It is going to be the first phone of the brand that is receiving the Dimensity chipset.

Recently, a Chinese leakster, WHYLAB leaked some images of the X9 Pro. Design wise, the Realme X9 Pro gets a design from the previously unveiled Realme X2 Pro Master Edition. Additionally, the X9 Pro Master Edition will have a curvy display. The punch hole is placed at the top corner. The rfresh rate of the display will be 120Hz. The Realme X9 Pro Master Edition is set to be the first phone top feature the curved display and also the first phone to be powered by Dimensity chipset as well.

On the rear side, the phone has triple camera setup arranged vertically and accompanied by a pill shaped LED flash. According to tipster, the Realme X9 Pro Master Edition will be fueled with a 4,500 mAh battery with a 65W fast charging support.